The XFP moduleis compliant with the 10G Small Form-Factor Pluggable (XFP) Multi-Source Agreement (MSA), supporting data-rate of 8.0~11.1Gbps, and transmission distance up to 300m withOM3 MMF.
The transceiver module comprises a transmitter with 850nm VCSEL laser and a receiver with a PIN photodiode. Transmitter and receiver are separate within a wide temperature range and offers optimum heat dissipation and excellent electromagnetic shielding thus enabling high port densities for 10 GbE systems.
Product Features
Product Features
Supports 8.0Gb/s to 11.1Gb/s bit rates
Hot-pluggable XFP footprint, Built-in digital diagnostic
Maximum link length of 300m with MMF-OM3
850nm VCSEL laser and PIN photodiode
XFP MSA package with duplex LC connector
No reference clock required
Single +3.3V power supply
Power dissipation <1.5W
Compatible with RoHS
Temperature range：0 to +70°C
Applications
Applications
SONET OC-192&SDH STM-64 at 9.953Gbps
10GBASE-SR/SW 10G Ethernet
1200-MX-SN-I 10Gigabit Fiber Channel
10GE over G.709 at 11.09Gbps
OC192 over FEC at 10.709Gbps
Other optical links, up to 11.3Gbps
Absolute Maximum Ratings
Absolute Maximum Ratings
Parameter
Symbol
Min
Max
Unit
Supply Voltage
Vcc
-0.5
4.5
V
Storage Temperature
Ts
-40
+85
°C
Operating Humidity
–
5
85
%
Any stress beyond the maximum ratings can result in permanent damage. The device specifications are guaranteed only under the recommended operating conditions.
Recommended Operating Conditions
Recommended Operating Conditions
Parameter
Symbol
Min
Typical
Max
Unit
Operating Case Temperature
Tc
0
+70
°C
Power Supply Voltage @3.3V
Vcc
3.135
3.30
3.465
V
Power Supply Current
Icc
500
mA
Data Rate
8.0
11.1
Gbps
Optical and Electrical Characteristics
Optical and Electrical Characteristics
Parameter
Symbol
Min
Typical
Max
Unit
Notes
Transmitter
Centre Wavelength
λc
840
850
860
nm
Spectral Width（RMS）
Δλ
0.45
nm
Side-Mode Suppression Ratio
SMSR
–
–
–
dB
Average Output Power
Pout
-6.5
-0.5
dBm
1
Extinction Ratio
ER
3.0
dB
Data Input Swing Differential
VIN
180
950
mV
2
Input Differential Impedance
ZIN
90
100
110
Ω
TX Disable
Disable
2.0
Vcc
V
Enable
0
0.8
V
Receiver
Centre Wavelength
λc
840
860
nm
Receiver Sensitivity
-11.1
dBm
3
Receiver Overload
0.5
dBm
3
LOS De-Assert
LOSD
-12
dBm
LOS Assert
LOSA
-26
dBm
LOS Hysteresis
0.5
4
dB
Data Output Swing Differential
Vout
400
600
800
mV
2
LOS
High
2.0
Vcc
V
Low
0.8
V
Notes:
The optical power is launched into MMF.
Internally AC-coupled.
Measured with a PRBS 231-1 test pattern @9953Mbps, BER ≤1×10-12.
Management Interface
Management Interface
The transceivers provide serial ID memory contents and diagnostic information about the present operating conditions by the 2-wireserial interface (SCL, SDA).
The Module provides diagnostic information about the present operating conditions. The transceiver generates this diagnostic data by digitization of internal analog signals. Alarm/warning threshold data is written during device manufacture. Received power monitoring, transmitted power monitoring, bias current monitoring, supply voltage monitoring and temperature monitoring all are implemented.
The digital diagnostic memory map specific data field defines as following.
Recommended Host Board Power Supply Circuit
Recommended Host Board Power Supply Circuit
The transceivers provide serial ID memory contents and diagnostic information about the present operating conditions by the 2-wireserial interface (SCL, SDA).
The diagnostic information with internal calibrationor external calibration all are implemented, including received power monitoring, transmitted power monitoring, bias current monitoring, supply voltage monitoring and temperature monitoring.
The digital diagnostic memory map specific data field defines as following.
Pin Descriptions
Pin Descriptions
Pin
Signal Name
Description
Plug Seq.
Notes
1
VEET
Transmitter Ground
1
2
TX FAULT
Transmitter Fault Indication
3
Note1
3
TXDISABLE
Transmitter Disable
3
Note2
4
SDA
SDA Serial Data Signal
3
5
SCL
SCL Serial Clock Signal
3
6
MOD_ABS
Module Absent. Grounded within the module
3
7
RS0
Not Connected
3
8
LOS
Loss of Signal
3
Note 3
9
VEER
Receiver ground
1
10
VEER
Receiver ground
1
11
VEER
Receiver ground
1
12
RD-
Inv. Received Data Out
3
Note 4
13
RD+
Received Data Out
3
Note 4
14
VEER
Receiver ground
1
15
VCCR
Receiver Power Supply
2
16
VCCT
Transmitter Power Supply
2
17
VEET
Transmitter Ground
1
18
TD+
Transmit Data In
3
Note 5
19
TD-
Inv. Transmit Data In
3
Note 5
20
VEET
Transmitter Ground
1
Notes:
Plug Seq.: Pin engagement sequence during hot plugging.
1) TX Fault is an open collector output, which should be pulled up with a 4.7k~10kΩ resistor on the host board to a voltage between 2.0V and Vcc+0.3V. Logic 0 indicates normal operation; Logic 1 indicates a laser fault of some kind. In the low state, the output will be pulled to less than 0.8V.
2) Laser output disabled on TDIS >2.0V or open, enabled on TDIS <0.8V.
3) LOS is open collector output. Should be pulled up with 4.7k~10kΩ on host board to a voltagebetween 2.0V and 3.6V. Logic 0 indicates normal operation; logic 1 indicates loss of signal.
4) RD-/+: These are the differential receiver outputs. They are internally AC-coupled 100 differential lines which should be terminated with 100Ω (differential) at the user SERDES.
5) TD-/+: These are the differential transmitter inputs. They are internally AC-coupled, differential lines with 100Ω differential termination inside the module.
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